Fast 3D imaging of defects in semiconductor devices

Project

Fast 3D imaging of defects in semiconductor devices

During the manufacture of semiconductor devices such as Mosfetts it is essential to inspect the device for cracks and other damage. It is required to obtain 3D images at NIR wavelength for which the semiconductor is transparent. The images should have high resolution and should be acquired at high speed. This project is carried out in the framework of the TTW Perspective programme ADOPSYS, in collaboration with the company Nexperia.

Information: Jeroen Kalkman, Paul Urbach


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Advanced Traceable Metrology for Optical Constants (ATMOC)

Understanding the size-dependent properties of various material ultra-thin films for integrated circuits is critical for nanotechnology innovation. Photonic measurement methods in the soft-X ray to IR wavelength range that approach theoretical limits ...

project

Advanced Traceable Metrology for Optical Constants (ATMOC)

SEQUOIA Project

SENSING USING QUANTUM OCT WITH AI ...

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SEQUOIA Project

Leading by Light Guidance

Optical coherence; optimal delivery and positioning (OPTIC) The newest generation of optical sensors and light sources must be able to conduct many colours of light from source to destination. The OPTIC programme develops ...

project

Leading by Light Guidance

Extreme UV and Soft X-Ray metrology

Continuous progress in the semi-conductor industry are leading to smaller, faster and more energy efficient chips for our modern society. Critical parameters for this industry, such as overlay and critical dimension (CD), ...

project

Extreme UV and Soft X-Ray metrology

Free Form Scattering Optics

The Free-Form Scattering Optics program is a joint initiative where three Universities of The Netherlands (TUDelft, University of Twente, TU Eindhoven) work together to enable high-tech optical devices that contribute to energy efficacy, climate ...

project

Free Form Scattering Optics

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